Publications

Recent Advances in Thin-Beam based LTPS Processing of Large Area Backplanes for Flat-Panel Displays

M. Shane Bowen and David S. Knowles

Abstract
As flat-panel displays add increasing resolution and advanced capabilities, designers are pushing for smaller and faster high-performance driver and support circuitry. This translates into a requirement for enhanced thin-film transistor performance necessitating increased electron mobility and material uniformity in the poly-Silicon backplane. In this presentation, a review of TCZ's Thin Beam Directional 'Xtallization (TDX) technology as well as an introduction of recent experimental results illustrating the versatility of thin-beam based LTPS processing will be given. As the TDX process moves toward full production, these results indicate the viability of using a thin-beam for not only TDX and sequential lateral solidification (TB-SLS) processing, but also for thin-beam excimer laser annealing (TB-ELA) as alternative, and complimentary operational modes of the TCZ900X high-volume production system.

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