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TCZ900X High Volume Thin Beam LTPS Processing System

Developed for creating highly uniform SOG (system on glass) grade LTPS (low temperature poly silicon) material of highest electron mobility and ultra smooth surface roughness, the TCZ900X presents an innovative production system for fabricating flat panel displays.

Besides improving uniformity, electron mobility and surface roughness of the LTPS material, TCZ targets to provide display makers with industry leading productivity and yield. Utilizing proprietary laser technology of Cymer and the comprehensive optics expertise of Carl Zeiss, the TCZ900X has been designed to extend laser power, beam stability and process control to levels beyond those obtainable with laser annealing systems and -processes currently available in the market.

Based on TCZ's unique, patented Thin Beam LTPS Processing Technology, the highly versatile TCZ900X can be operated in various operational modes, including:

This provides display makers with an increased flexibility to produce LTPS materials of different microstructure, and optimize these for a larger range of Applications, including AMLCD (active matrix liquid crystal displays), SOG, next generation OLED (organic light emitting diode) displays, and added pixel functionality including pixel memory and touch screen or scanning capability.

With Cymer's high power XLX200 Laser and with high performance stage and optics systems provided by Carl Zeiss, the TCZ900X features:

  • Precision handling of substrates sizes up to 920 mm x 730 mm (Generation 4)
  • Comprehensive system- and module metrology for improved stability and control
  • Full 730 mm beam length for scanning substrates in single passes to avoid stitching
  • Multi-kHz laser repetition rates facilitating substrate scan speeds of up to 176 cm²/s, compatible with cycle times of 100 seconds or less

Please contact Sales & Service for detailed Product Specifications or Demonstrations.