NEWS RELEASE

TCZ TO PRESENT ON IDMC 2007 CONFERENCE

TCZ has been selected to present an invited paper on recent advances in thin-beam based LTPS processing of large area back panels for flat panel displays on the IDMC 2007 conference to be held in Taipei, Taiwan from July 3-6, 2007. A review of TCZ's thin beam directional 'xtallization (TDX) technology as well as an introduction of recent experimental results illustrating the versatility of thin-beam based LTPS processing will be given.These results indicate the viability of using thin-beam for not only TDX and sequential lateral solidification (TB-SLS) processing, but also for thin-beam excimer laser annealing (TB-ELA) as alternative, and complimentary operational modes of the TCZ-900X high-volume production system.